Lithographic apparatus and device manufacturing method

ABSTRACT

A lithographic apparatus having an improved transfer unit, is presented. The lithographic apparatus includes a processing unit that performs a lithographic process involving exchangeable objects in which the processing unit includes an illumination system that provides a beam of radiation, a support structure configured to support a patterning device that imparts a desired pattern to the beam of radiation, a substrate holder configured to hold a substrate, and a projection system configured to project the patterned beam onto a target portion of the substrate. The lithographic apparatus also includes a transfer unit comprising a single robot. The single robot is configured to transfer a first exchangeable object from a loading station to the processing unit and to transfer a second exchangeable object from the processing unit to a discharge station.

This is a continuation-in-part of U.S. patent application Ser. No.10/871,528 filed Jun. 21, 2004.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a lithographic apparatus and anassociated device manufacturing method.

2. Description of the Related Art

Lithographic apparatus can be used, for example, in the manufacture ofintegrated circuits (ICs). In such a case, a patterning device may beused to generate a desired circuit pattern corresponding to anindividual layer of the IC, and this pattern can be imaged onto a targetportion (e.g. comprising one or more dies) on a substrate (siliconwafer) that has been coated with a layer of radiation-sensitive material(resist).

In general, a single substrate will contain a network of adjacent targetportions that are successively exposed. Known lithographic apparatusinclude so-called steppers, in which each target portion is irradiatedby exposing an entire pattern onto the target portion in one go, andso-called scanners, in which each target portion is irradiated byscanning the pattern through the projection beam in a given direction(the “scanning”-direction) while synchronously scanning the substrateparallel or anti-parallel to this direction.

The processing of substrates requires that the substrates, destined forprocessing, are supplied to the lithographic apparatus and, afterprocessing, the processed substrates are removed from the apparatus.Generally, a track brings the substrates, which are to be processed to aloading station. From this loading station, the substrates are movedone-by-one to the processing unit of a lithographic apparatus, in whichthe actual processing of the substrate takes place.

Processed substrates are then generally moved, one-by-one, from theprocessing unit of the lithographic apparatus to a discharge station. Atrack generally takes the processed substrates away from the dischargestation.

Other ways of supplying the substrates to the lithographic apparatus andremoving substrates from the lithographic apparatus are known to theperson skilled in the art, such as, for example, the use of a frontopening unified pod. The front opening unified pod contains a pluralityof substrates, and supplies them one-by-one to the loading station.

In known lithographic apparatus, a transfer unit for transferring asubstrate, which is to be processed, from a loading station to theprocessing unit and for transferring the processed substrate from theprocessing unit to a discharge station is provided. The known transferunit comprises a loading robot and a discharge robot. The loading robottakes a substrate, which is to be processed, from the loading station tothe processing unit of the lithographic apparatus. The discharge robotthen takes the processed substrate from the processing unit of thelithographic apparatus to the discharge station.

This known transfer unit setup is quite expensive, and requires arelatively large amount of space.

SUMMARY OF THE INVENTION

The principles of the present invention, as embodied and broadlydescribed herein, provide for a lithographic apparatus having a transferunit that is less expensive and relatively smaller than the knowntransfer unit. In one embodiment, the lithographic apparatus comprises aprocessing unit configured to perform a lithographic process involvingexchangeable objects, the processing unit comprising an illuminationsystem that provides a beam of radiation, a support structure configuredto support a patterning device that imparts a desired pattern to thebeam of radiation, a substrate holder configured to hold a substrate,and a projection system configured to project the patterned beam onto atarget portion of the substrate. The lithographic apparatus alsoincludes a transfer unit comprising a single robot. The single robot isconfigured to transfer a first exchangeable object from a loadingstation to the processing unit and to transfer a second exchangeableobject from the processing unit to a discharge station.

The exchangeable object can be a substrate, but also an other type ofobject that needs to be exchanged every once in a while. By using onlyone robot instead of the conventional two robots, the transfer unitbecomes cheaper and requires less space.

Preferably, the robot comprises a first object handler for transferringthe first exchangeable object from the loading station to the processingunit and a second object handler for transferring the secondexchangeable object from the processing unit to the discharge station.

This configuration of the robot allows an effective and relativelysimple design.

In one embodiment, the first object handler is coupled to a first armand the second object handler is coupled to a second arm, the first armand the second arm being rotatable around an axis of rotation. In thisembodiment, the rotational movement of the arms is used to transferexchangeable objects.

Advantageously, at least one of the first arm and the second arm ismoveable in a direction which is at least substantially parallel to theaxis of rotation. The introduction of this extra degree of freedom inthe handling of the exchangeable objects provides enhanced flexibilitywith respect to the movements of the exchangeable objects.

Also, the position of the axis of rotation may be fixed relative to theprocessing unit. This results in a very simple and robust design of therobot, since only the rotation of the arms has to be controlled.

Moreover, the first arm and the second arm may be fixed relative to eachother in such a manner that they enclose a constant angle between them.This simplifies the design of the robot even more, since only onerotational movement has to be controlled.

In known lithographic apparatus, usually an interferometer unit islocated close to substrate table that receives the substrate from thetransfer unit. Preferably, when the robot is used to transfer substratesin the area of the substrate table and the interferometer unit, theshape of the arms is adapted so that they can pass the interferometer. Ageneral z-shape of the longitudinal section is found to be suitable forthe shape of the arms.

In another embodiment, the first object handler and the second objecthandler are coupled to a common robot arm which is adapted to move thefirst object handler and the second object handler relative to theprocessing unit.

Advantageously, at least one object handler is coupled to a wristassembly which wrist assembly allows the object handler coupled theretoto rotate relative to the robot arm.

Moreover, in this embodiment the first object handler and the secondobject handler are both coupled to the wrist assembly. Advantageously,the first object handler and the second object handler are fixedrelative to each other in such a manner that they enclose a constantangle between them.

Furthermore, the transfer unit comprises docking mechanism which areadapted to co-operate with a part of the processing unit that is adaptedto carry the exchangeable object for positioning at least one objecthandler relative to the processing unit. This allows a reliable andaccurate positioning of the exchangeable object relative to theprocessing unit.

An alternative measure for allowing reliable and accurate positioning ofthe exchangeable object relative to the processing unit is to provide acombination of wrist assembly and object handlers, which combination isdetachable from the robot arm when at least one object handler ispositioned relative to the processing unit. This measure can also becombined with the docking mechanism as described in the previousparagraph.

According to a further embodiment, there is provided a devicemanufacturing method comprising providing a substrate that is at leastpartially covered by a layer of radiation-sensitive material, providinga beam of radiation via an illumination system, configuring the beam ofradiation with a desired pattern in its cross-section based on apatterning device, projecting the patterned beam of radiation onto atarget portion of the substrate and transferring a first exchangeableobject from a loading station to the processing unit and transferring asecond exchangeable object from the processing unit to a dischargestation via a single robot.

Although specific reference may be made in this text to the use oflithographic apparatus in the manufacture of ICs, it should beunderstood that the lithographic apparatus described herein may haveother applications, such as the manufacture of integrated opticalsystems, guidance and detection patterns for magnetic domain memories,liquid-crystal displays (LCDs), thin-film magnetic heads, etc. Theskilled artisan will appreciate that, in the context of such alternativeapplications, any use of the terms “wafer” or “die” herein may beconsidered as synonymous with the more general terms “substrate” or“target portion”, respectively.

The substrate referred to herein may be processed, before or afterexposure, in for example a track (a tool that typically applies a layerof resist to a substrate and develops the exposed resist) or a metrologyor inspection tool. Where applicable, the disclosure herein may beapplied to such and other substrate processing tools. Further, thesubstrate may be processed more than once, for example in order tocreate a multi-layer IC, so that the term substrate used herein may alsorefer to a substrate that already contains multiple processed layers.

The terms “radiation” and “beam” used herein encompass all types ofelectromagnetic radiation, including ultraviolet (UV) radiation (e.g.having a wavelength of 365, 248, 193, 157 or 126 nm) and extremeultra-violet (EUV) radiation (e.g. having a wavelength in the range of5-20 nm), as well as particle beams, such as ion beams or electronbeams.

The term “patterning device” used herein should be broadly interpretedas referring to a device that can be used to impart a projection beamwith a pattern in its cross-section such as to create a pattern in atarget portion of the substrate. It should be noted that the patternimparted to the projection beam may not exactly correspond to thedesired pattern in the target portion of the substrate. Generally, thepattern imparted to the projection beam will correspond to a particularfunctional layer in a device being created in the target portion, suchas an integrated circuit.

The patterning device may be transmissive or reflective. Examples ofpatterning means include masks, programmable mirror arrays, andprogrammable LCD panels. Masks are well known in lithography, andinclude mask types such as binary, alternating phase-shift, andattenuated phase-shift, as well as various hybrid mask types. An exampleof a programmable mirror array employs a matrix arrangement of smallmirrors, each of which can be individually tilted so as to reflect anincoming radiation beam in different directions; in this manner, thereflected beam is patterned.

The support structure supports, i.e. bears the weight of, the patterningdevice. It holds the patterning device in a way depending on theorientation of the patterning means, the design of the lithographicapparatus, and other conditions, such as for example whether or not thepatterning means is held in a vacuum environment. The support can beusing mechanical clamping, vacuum, or other clamping techniques, forexample electrostatic clamping under vacuum conditions. The supportstructure may be a frame or a table, for example, which may be fixed ormovable as required and which may ensure that the patterning device isat a desired position, for example with respect to the projectionsystem. Any use of the terms “reticle” or “mask” herein may beconsidered synonymous with the more general term “patterning device”.

The term “projection system” used herein should be broadly interpretedas encompassing various types of projection system, including refractiveoptical systems, reflective optical systems, and catadioptric opticalsystems, as appropriate for example for the exposure radiation beingused, or for other factors such as the use of an immersion fluid or theuse of a vacuum. Any use of the term “lens” herein may be considered assynonymous with the more general term “projection system”.

The illumination system may also encompass various types of opticalcomponents, including refractive, reflective, and catadioptric opticalcomponents for directing, shaping, or controlling the projection beam ofradiation, and such components may also be referred to below,collectively or singularly, as a “lens”.

The lithographic apparatus may be of a type having two (dual stage) ormore substrate tables (and/or two or more mask tables). In such“multiple stage” machines the additional tables may be used in parallel,or preparatory steps may be carried out on one or more tables while oneor more other tables are being used for exposure.

The lithographic apparatus may also be of a type wherein the substrateis immersed in a liquid having a relatively high refractive index, e.g.water, so as to fill a space between the final element of the projectionsystem and the substrate. Immersion liquids may also be applied to otherspaces in the lithographic apparatus, for example, between the mask andthe first element of the projection system. Immersion techniques arewell known in the art for increasing the numerical aperture ofprojection systems.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the invention will now be described, by way of exampleonly, with reference to the accompanying schematic drawings in whichcorresponding reference symbols indicate corresponding parts, and inwhich:

FIG. 1 depicts a lithographic apparatus according to an embodiment ofthe invention;

FIG. 2 schematically shows a first embodiment of the invention;

FIG. 3 schematically shows the process of supplying and dischargingsubstrates using the embodiment of FIG. 2,

FIG. 4 schematically shows an elevational view of the embodiment of FIG.2;

FIG. 5 schematically shows a second embodiment of the invention;

FIG. 6 schematically shows the process of supplying and dischargingsubstrates using the embodiment of FIG. 5;

FIG. 7 is a schematic top view of an embodiment of a track interfacehaving a stacked input/output station to be situated between a track anda processing unit of an lithographic apparatus;

FIGS. 8 a-b schematically show side views of the embodiment of FIG. 7;

FIG. 9 schematically shows a configuration of a substrate bufferprovided with air showers; and

FIG. 10 schematically shows a configuration of a substrate bufferprovided with belts for carrying substrates and an air shower locatedabove the belts.

DETAILED DESCRIPTION OF THE INVENTION

Although embodiments of the transfer unit of the present invention willbe described within the context of a lithographic apparatus for clarity,it will be appreciated that the transfer unit, as disclosed, may beequally applied to other technologies and/or systems. It will also beappreciated that the transfer unit may be employed for exchangeableobjects other than the disclosed substrate.

FIG. 1 schematically depicts a lithographic apparatus according to aparticular embodiment of the invention. The apparatus comprises:

-   -   an illumination system (illuminator) IL: for providing a        projection beam PB of radiation (e.g. UV or EUV radiation).    -   a first support structure (e.g. a mask table/holder) MT: for        supporting patterning device (e.g. a mask) MA and coupled to        first positioning mechanism PM for accurately positioning the        patterning device with respect to item PL;    -   a substrate table (e.g. a wafer table/holder) WT: for holding a        substrate (e.g. a resist-coated wafer) W and coupled to second        positioning mechanism PW for accurately positioning the        substrate with respect to item PL; and    -   a projection system (e.g. a reflective projection lens) PL: for        imaging a pattern imparted to the projection beam PB by        patterning device MA onto a target portion C (e.g. comprising        one or more dies) of the substrate W.

As here depicted, the apparatus is of a transmissive type (e.g.employing a transmissive mask). Alternatively, the apparatus may be of areflective type (e.g. or a programmable mirror array of a type asreferred to above).

The illuminator IL receives a beam of radiation from a radiation sourceSO. The source and the lithographic apparatus may be separate entities,for example when the source is a plasma discharge source. In such cases,the source is not considered to form part of the lithographic apparatusand the radiation beam is generally passed from the source SO to theilluminator IL with the aid of a radiation collector comprising forexample suitable collecting mirrors and/or a spectral purity filter. Inother cases the source may be integral part of the apparatus, forexample when the source is a mercury lamp. The source SO and theilluminator IL, may be referred to as a radiation system.

The illuminator IL may comprise adjusting mechanism for adjusting theangular intensity distribution of the beam. Generally, at least theouter and/or inner radial extent (commonly referred to as σ-outer andσ-inner, respectively) of the intensity distribution in a pupil plane ofthe illuminator can be adjusted. The illuminator provides a conditionedbeam of radiation, referred to as the projection beam PB, having adesired uniformity and intensity distribution in its cross-section.

The projection beam PB is incident on the mask MA, which is held on themask table MT. Being reflected by the mask MA, the projection beam PBpasses through the lens PL, which focuses the beam onto a target portionC of the substrate W. With the aid of the second positioning mechanismPW and position sensor IF2 (e.g. an interferometric device), thesubstrate table WT can be moved accurately, e.g. so as to positiondifferent target portions C in the path of the beam PB. Similarly, thefirst positioning mechanism PM and position sensor IF1 can be used toaccurately position the mask MA with respect to the path of the beam PB,e.g. after mechanical retrieval from a mask library, or during a scan.In general, movement of the object tables MT and WT will be realizedwith the aid of a long-stroke module and a short-stroke module, whichform part of the positioning mechanism PM and PW. However, in the caseof a stepper (as opposed to a scanner) the mask table MT may be coupledto a short stroke actuator only, or may be fixed. Mask MA and substrateW may be aligned using mask alignment marks M1, M2 and substratealignment marks P1, P2.

The depicted apparatus can be used in the following preferred modes:

-   -   step mode: the mask table MT and the substrate table WT are kept        essentially stationary, while an entire pattern imparted to the        projection beam is projected onto a target portion C in one go        (i.e. a single static exposure). The substrate table WT is then        shifted in the X and/or Y direction so that a different target        portion C can be exposed. In step mode, the maximum size of the        exposure field limits the size of the target portion C imaged in        a single static exposure.    -   scan mode: the mask table MT and the substrate table WT are        scanned synchronously while a pattern imparted to the projection        beam is projected onto a target portion C (i.e. a single dynamic        exposure). The velocity and direction of the substrate table WT        relative to the mask table MT is determined by the        (de-)magnification and image reversal characteristics of the        projection system PL. In scan mode, the maximum size of the        exposure field limits the width (in the non-scanning direction)        of the target portion in a single dynamic exposure, whereas the        length of the scanning motion determines the height (in the        scanning direction) of the target portion.    -   other mode: the mask table MT is kept essentially stationary        holding a programmable patterning device, and the substrate        table WT is moved or scanned while a pattern imparted to the        projection beam is projected onto a target portion C. In this        mode, generally a pulsed radiation source is employed and the        programmable patterning device is updated as required after each        movement of the substrate table WT or in between successive        radiation pulses during a scan. This mode of operation can be        readily applied to maskless lithography that utilizes        programmable patterning device, such as a programmable mirror        array of a type as referred to above.

Combinations and/or variations on the above described modes of use orentirely different modes of use may also be employed.

FIG. 2 illustrates one embodiment of the present invention, in which aprocessing unit 5 of a lithographic apparatus is provided for processingsubstrates 1. The substrates 1 to be processed are supplied to theprocessing unit 5 by means of a transfer unit comprising a robot 10. Inaccordance with a feature of the present invention, the same robot 10also takes processed substrates 1 away from the processing unit 5.

A track 50 transports the substrates 1 to be processed to thelithographic apparatus and transports the processed substrates 1 awayfrom the lithographic apparatus, for example, to an etching device (notshown). The track 50 delivers the substrates 1, one-by-one, to a loadingstation 30, which comprises a receiving unit 31 and a loading unit 32.The receiving unit 31 can receive one of the substrates 1 from the track50, while the loading unit 32 can load one of the substrates 1 to therobot 10.

The loading station 30 can act as a buffer for the supply of substrates1 to the processing unit 5. This is particularly advantageous since thesubstrates 1 generally are delivered by the track 50 at irregular timeintervals. By using the loading station 30 as a buffer the chance of astand still of the processing unit 5 in case of an irregular delivery ofsubstrates 1 by the track 50 is reduced with respect to a system withoutsuch a buffer.

Preferably, the loading station 30 is provided with means to preparesubstrates 1 for processing. For example, a pre-alignment unit can beprovided for determining respective dimensions of the respectivesubstrates 1 or the position of respective substrates 1. Measuringdimensions and/or the position provides information that can be used foraccurate positioning of the respective substrate relative to an objecthandler of the robot 10 and/or to the processing unit 5.

The means for preparing a substrate 1 for processing can also comprise atemperature stabilizing unit (TSU), which brings a substrate 1 to apredetermined temperature. The temperature sensitive processes in theprocessing unit 5 preferably has a predetermined temperature of thesubstrate 1. By using a temperature stabilization unit, the substrate 1can already be brought at or at least close to this predeterminedtemperature.

Preferably, preparing the substrate 1 for processing as described abovetakes place during the buffering of the substrate 1. This saves valuableprocessing time in the processing unit 5.

A transfer unit is provided to take the substrates 1 one-by-one awayfrom the loading station 30 to the processing unit 5, and to takeprocessed substrates 1 away from the processing unit 5 to a dischargestation 40. This transfer process is illustrated in FIG. 3.

The transfer unit has a single robot 10, which is provided with a firstobject handler 11 (FIG. 4). The first object handler 11 engages a firstsubstrate 1 a at the loading station 30.

Preferably, in the loading unit 32, the relevant substrate 1 issupported by one or more pins 7, which are adapted to move the firstsubstrate 1 a in a direction which is substantially perpendicular to aplane defined by a lithographic pattern present on the relevantsubstrate 1.

In one embodiment, the pins 7 lift the first substrate 1 a when thefirst object handler 11 approaches (FIG. 3D). The first object handler11 is then positioned below the first substrate 1 a. The pins 7 thenlower the first substrate 1 a so that the first substrate 1 a comes tolie upon the first object handler 11.

The robot 10 of the transfer unit also comprises a second object handler21. When a first substrate 1 a is loaded onto the first object handler11, the second object handler 21 is empty (FIG. 3D).

The robot 10 then moves the second object handler 21 to the processingunit 5. The processing unit 5 provides a second substrate 1 b, which hasbeen processed by the processing unit 5 (FIG. 3E). The second objecthandler 21 takes over the second substrate 1 b (FIG. 3A).Advantageously, also the processing unit 5 is provided with pins 7 whichare adapted to move the second substrate 1 b in a direction which issubstantially perpendicular to the plane containing the pattern of thesubstrate 1. In one embodiment, the pins 7 lift the second substrate 1 bbefore the second object handler 21 approaches. After the lifting of thesubstrate 1 b by the pins 7, the second object handler 21 is positionedbelow the second substrate 1 b. The pins 7 then lower the secondsubstrate 1 b so that the second substrate 1 b comes to lie upon thesecond object handler 21.

The robot 10 then moves the second substrate 1 b away from theprocessing unit 5 and moves the first substrate 1 a towards theprocessing unit 5 (FIG. 3B). After positioning the first substrate 1 arelative to the processing unit 5, the first substrate 1 a is loaded tothe processing unit 5.

Then, the robot 10 moves the second substrate 1 b to discharge station40. Now, the first object handler 11 is empty (FIG. 3C). At thedischarge station 40, the second substrate 1 b is removed from thesecond object handler 21, and delivered to the track 50. Just like theloading station 30, the discharge station 40 can act as a buffer, ifrequired. For removing the second substrate 1 b from the second objecthandler 21, pins 7 like described before can be used: the second objecthandler 21 positions the second substrate 1 b above the pins 7, the pins7 rise and lift the substrate 1 off the second object handler 21, andthe second object handler 21 is moved away (FIG. 3E).

When the second substrate 1 b is removed from the second object handler21, the first object handler 11 is moved to the loading station 30 tocollect a third substrate 1 c.

As an alternative, the object handlers 11, 21 can be moveable in adirection substantially perpendicular to the axis of rotation. Herewith,the object handlers may be lowered to engage the underside of thesubstrate 1.

In the embodiment of FIG. 2, the object handlers engage the underside ofthe substrate 1. It is, however, also possible that the object handlersengage the substrate 1 in an other way, such as by the edge of thesubstrate 1 or by means of a suction cup engaging on the top of thesubstrate 1.

Also, in the embodiment of FIG. 2, the robot 10 comprises a first arm 12and a second arm 22. The first object handler 11 is coupled to the firstarm 12 and the second object handler 21 is coupled to the second arm 22.Both arms 12,22 are rotatable around hub 15. In the example of FIG. 2,the hub 15 is arranged such that it provides an axis of rotation 15 aoriented substantially perpendicularly to the plane of a substrate 1which is present on one of the object handlers.

Moreover, in the example of FIG. 2, the first arm 12 and the second arm22 are fixed relative to each other in such a manner that they enclose aconstant angle between them, as seen in the direction parallel to theaxis of rotation 15 a. It is, however, also possible that the arms 12,22can rotate independently of each other. In that case, their rotationscan be in the same direction, or in opposite directions.

Furthermore, in the example of FIG. 2, the position of the axis ofrotation 15 a is fixed relative to the processing unit 5. Fixing thearms 12,22 at a constant relative angle and fixing the position of theaxis of rotation 15 a relative to the processing unit 5 reduces thedegrees of freedom of the robot 10 as a whole. This reduction in degreesof freedom leads to a simple design of the robot 10 with just a fewmoving parts, and also the control system for actuating the robot 10 canbe kept very simple. Also, as is clear from FIG. 3, in the embodimentaccording to the example of FIG. 2 the transfer of a first substrate 1 afrom the loading station 30 to the processing unit 5 and the transfer ofa second substrate 1 b from the processing unit 5 to the discharge unittakes place substantially within a single revolution of the first arm 12and the second arm 22 around the axis of rotation 15 a.

On the other hand, more degrees of freedom may be desired. This can berealized in various ways. Both arms 12,22, or at least one of them canbe made moveable in a direction that is substantially parallel to theaxis of rotation 15 a. Also, the hub 15 can be made moveable relative tothe processing unit 5, and/or one or both arms 12,22 can be madeextendable, so that their length can be varied.

FIG. 4 shows an elevational view of the embodiment of FIG. 2. In thisexample, the lithographic apparatus also comprises an interferometer 60for determining the position of the substrate table. As can be seen inFIG. 3, the interferometer 60 is in the way of the arms 12,22 of therobot 10 as they perform their rotation. In order to avoid collision,the arms 12,22 are generally z-shaped with two horizontal parts at adifferent height and an intermediate part connecting the two horizontalparts, as is shown in FIG. 4. This way, the arms 12,22 can pass theinterferometer 60 during the rotation of the arms 12,22. Such anadaptation of the shape of the arms as described above can also be usedwhen other objects are in the way.

FIG. 5 depicts a second embodiment of the present invention. In thisembodiment a processing unit 5 is also provided for processingsubstrates 1. The substrates 1 to be processed are supplied to theprocessing unit 5 by means of a transfer unit comprising a robot 110.The same robot 110 also takes processed substrates 1 away from theprocessing unit 5.

A track 50 transports substrates 1 which are to be processed to thelithographic apparatus and transports processed substrates 1 away fromthe lithographic apparatus, for example to an etching device.

The track 50 delivers the substrates 1 one-by-one to a loading station30, which comprises a receiving unit 31 and a loading unit 32. Thereceiving unit 31 receives a substrate 1 from the track 50, while theloading unit 32 loads a substrate 1 to the robot 110. The loadingstation 30 can act as a buffer for the supply of substrates 1 to theprocessing unit 5. This is particularly advantageous since thesubstrates 1 generally are delivered by the track 50 at irregular timeintervals. By using the loading station 30 as a buffer, the occurrenceof a stand still of the processing unit in case of an irregular deliveryof substrate by the track is reduced compared with a system lacking sucha buffer.

Preferably, the loading station 30 is provided with means to prepare asubstrate 1 for processing, as described above with respect to theembodiment of FIG. 2.

A transfer unit is provided to take the substrates 1 one-by-one awayfrom the loading station 30 to the processing unit 5, and to takeprocessed substrates 1 away from the processing unit 5 to a dischargestation 40. This transfer process is illustrated in FIG. 6. The transferunit has a single robot 110, which is provided with a first objecthandler 111. The first object handler 111 engages a first substrate 1 aat the loading station 30.

The robot 110 of the transfer unit also comprises a second objecthandler 121. When a first substrate 1 a is loaded onto the first objecthandler 111, the second object handler 121 is empty. The robot 110 thenmoves the second object handler 121 to the processing unit 5. Theprocessing unit 5 provides a second substrate 1 b, which has beenprocessed by the processing unit 5. The second object handler 121 takesover the second substrate 1 b.

The second object handler 121 then moves the second substrate 1 b awayfrom the processing unit 5 and moves the first substrate 1 a towards theprocessing unit 5. After positioning the first substrate 1 a relative tothe processing unit 5, the first substrate 1 a is loaded to theprocessing unit 5.

Then, the robot 110 moves the second substrate 1 b to discharge station40. Now, the first object handler 111 is empty. At the discharge station40, the second substrate 1 b is removed from the second object handler121, and delivered to the track 50. Just like the loading station 30,the discharge station 40 can act as a buffer if this is required.

The object handlers 111, 121 can be similar to those of the embodimentof FIG. 2. Also, the way of loading and unloading the substrates 1 ontoand from the object handlers can take place in a similar way.

In an alternative embodiment, which is not shown in the drawing, thefirst object handler 111 is arranged above the second object handler121. The first object handler 111 occupies a fixed position relative tothe wrist assembly 127. The second object handler 121 however isrotatable.

In this embodiment, the loading and discharging of substrates takesplace as follows. The first object handler 111 collects a substrate 1 afrom the loading station 30. The robot 110 then moves the objecthandlers 111, 121 towards the processing unit 5. The second objecthandler 121 then engages a second substrate 1 b which is to bedischarged from the processing unit 5. Preferably, the second substrate1 b is lifted by means of pins 7 so that the second object handler 121can engage the substrate 1 b at the underside. When the substrate 1 b isengaged by the second object handler 121, the pins 7 are retracted.

Then, the second object handler 121 is rotated by the wrist assembly 127away from the processing unit 5. The robot 110 at this moment does notmove the wrist assembly away from the processing unit 5. The firstsubstrate 1 a can now be loaded to the processing unit 5. Preferably,this is done by lifting the pins 7 again, this time to the extend thatthey lift the first substrate 1 a off the first object handler 111.

Then, the robot 110 moves the object handlers 111, 121 away from theprocessing unit 5, and brings the second substrate 1 b to the dischargestation 40. The advantage of this embodiment is that the object handlers111, 121 are positioned with respect to the processing unit 5 in asingle action, so that they do not have to be positioned separately.

In the embodiment of FIG. 5, the object handlers 111, 121 are coupled toa common robot arm 120, which robot arm 120 is adapted to move theobject handlers 111, 121 relative to the processing unit.

In the embodiment of FIG. 5, the object handlers are coupled to a wristassembly 127, which wrist assembly is connectable to the robot arm 120.The wrist assembly 127 allows rotation of the object handlers 111, 121relative to the robot arm 120. In the example of FIG. 5, the firstobject handler 111 and the second object handler are fixed relative toeach other in such a manner that they enclose a constant angle. Thisway, the object handlers 111, 121 are rotated together.

In the embodiment of FIG. 5, the robot comprises docking mechanism 125.These docking mechanism 125 are adapted to cooperate with a counterelement 126, which is provided on the processing unit 5. For a reliableexchange from a substrate 1 to and/or from the processing unit 5, it isimportant that the object handler 111, 121 which is to handle thespecific substrate 1 and the processing unit 5 are positioned accuratelywith respect to one another.

This can be achieved by docking the robot 110 to the processing unit 5.The docking mechanism 125 provide a kinematic coupling between the wristassembly 127 and the processing unit 5. This coupling can be realized bymechanical means, but also in a different way such as by eddy currentdamping. In the example of FIG. 5, a docking mechanism 125 is providedbelow the wrist assembly 127 of the robot 110. However, the dockingmechanism 125 can also be arranged at a different position with respectto the wrist assembly 127.

In this example, the docking mechanism 125 is provided with at least onesemispherical projection 128. However, also other numbers or shapes ofthe projections 128 are possible. This depends on for how many degreesof freedom movement of the wrist assembly 127 and the processing unithas to be coupled.

When the wrist assembly 127 approaches the processing unit 5, thedocking mechanism 125 comes into engagement with the counter plate 126.The counter plate 126 is provided with at least one hole 129, which hole129 corresponds to the projection 128 of the docking mechanism 125. Thehole 129 and the projection 128 then “find” each other, and bring thewrist assembly 127 (which the object handlers 111, 121 coupled thereto)in a predetermined, accurate relative position with respect to theprocessing unit 5.

In this embodiment, it is advantageous that the wrist assembly 127 issomewhat flexibly coupled to the robot arm 120 with respect to thedegrees of freedom related to the kinematic coupling, so that in can bebrought into the predetermined position with respect to the processingunit 5 without becoming overly constrained. In practice, this means thatin every degree of freedom in which the kinematic coupling between thewrist assembly 127 and the processing unit 5 is active, the wristassembly 127 has to be moveable with respect to the robot arm.

This way of achieving a predetermined position between an object handler111, 121, 11, 21 and the processing unit 5 can also be used in theembodiment of FIG. 2. In that case, a docking mechanism has to beprovided on each arm 12, 22 or object handler 11, 21.

As described above, it is advantageous if the wrist assembly 127 isflexibly coupled to the robot arm 120 when docking mechanism are used toposition the object handlers 111, 121 relative to the processing unit 5.However, it is also envisaged to disconnect the wrist assembly 127 (withthe object handlers coupled thereto) from the robot arm 120 when thewrist assembly 127 is positioned relative to the processing unit 5. Thisway, the relative position of the object handler 111, 121 with respectto the processing unit is not disturbed by influences from the robot arm120, such as vibrations.

FIG. 7 schematically shows a track interface having a loading station 30and a transfer unit including a robot 10.1 and a robot 10.2. The trackintefface functions as an interface between the track 50 and theprocessing unit 5 and is configured as part of a high-productivitysubstrate handler with a dual input unit, comprising, for example, asubstrate receiving unit 31 and a pre-aligner 132. The substrate trackreceiving unit 31 is stacked vertically (see FIGS. 8 a-b) above thesubstrate track discharge station 40 (see FIG. 8 a) or under thesubstrate track discharge station 40 (vertical stack of inputloutputsubstrate units in lithographic substrate track interface) (see FIG. 8b). If the track interface is only fed with a track flow 50.1, then thereceiving unit 31 serves as a buffer between the substrate track 50 andthe pre-aligner station 132 and may take the pre-aligner 132 out of thecritical path.

The receiving unit 31 may be equipped with a substrate temperatureconditioning function (chill plate or air shower) positioned next to thechill plate of the pre-aligner 132. In this configuration, the substratecan be forced to the required temperature relatively fast which willincrease the throughput of the substrate handler. Thus, a substratetrack interface with parallel substrate conditioning and pre-alignmentcapability yielding a relatively high throughput is achieved. Note,however, that it is also possible to feed substrates via an additionaltrack flow 50.2 via the track to the pre-aligner 132 directly, such thata duo input track interface is obtained. The processed substrates flowout via the track according to the track flow 50.3.

The track interface according to FIG. 7 also comprises a control cabinet134 provided with control software and control equipment for controllingthe robots 10.1, 10.2 and for controlling the flow of substrates in thetrack interface (see, the dotted arrows 50.1, 50.2, 50.3 in FIG. 7indicating the flow of substrates). In addition, the track interface maybe provided with a holder 136 which can serve as an interface betweenthe track interface and a Front Opening Unified Pod (FOUP) forholding/transporting substrates. The FOUP can feed substrates to thetrack interface via the holder 136. This may be done, for example, ifthe supply via the track 50.1, 50.2 is hindered.

As already mentioned, it is possible that the track interface has twoinput units, such as, for example, the receiving unit 31 and thepre-aligner 132. In an advantageous embodiment, the receiving unit 31 isequipped with a pre-alignment function (sensor and rotation unit). Inthis case the two input units may be used in parallel for substrateinput and pre-alignment. Thus, two substrates can be prepared forexposure in the same time, thereby virtually boosting the substratehandler throughput by a factor of two relative to a conventional systemhaving only one input unit.

In another embodiment of the track interface according to FIG. 7, onlyone single robot 10 is provided instead of two (or more) robots 10.1,10.2 (for example by removing robot 10.1 and allocating its tasks torobot 10.2). This saves the cost of one robot.

In an embodiment of the track interface, multiple substrate positions137.1, 137.2 are stacked vertically. The stacked substrate positionsform a substrate-buffer 138. The substrate-buffer 138 can be providedwith air showers 139.1, 139.2, 139.3 (see FIG. 9) for temperaturecontrol of the substrates in the substrate-buffer. In the example ofFIG. 9 the substrates placed in the respective substrate positions aresandwiched between the air showers. In this way the temperature controlof the substrates placed in the substrate-buffer can be performedaccording to pre-determined specifications relating to suitabletemperatures for substrates to be processed in the processing unit 5.The substrate-buffer 138 can be moved in a vertical direction (theZ-direction) by means of the Z-stroke motor 140. The Z-stroke motor canposition the substrate-buffer 138 on a pre-determined height such thatthe robots 10.1 and/or 10.2 can pick a pre-selected substrate relativelyeasily and quickly from the associated substrate position which islifted to an appropriate height. Herewith a relatively high throughputis obtained.

The configuration of FIG. 9 yields reduced floor space of the associatedsubstrate handler.

In the track interface (for example according to FIG. 7) air showers maybe positioned both at the pre-aligner 132, and at the substrate receiveunit 31.

The gas flow on the substrate is preferably substantially perpendicularto the substrate surface for an optimal cooling capacity. For example,in case of a perpendicular gas/air flow, the substrate cooling time isabout one substrate cycle time (a cycle time roughly equals the timeneeded for processing a substrate in the processing unit 5). When thegas flow is parallel to the substrate surface, the heat exchangecoefficient is lower, such that about ten substrate cycle times arerequired to stabilize substrate temperature.

An embodiment of a track interface has a vertical stack of gas/airshowers. The stack is provided with a first substrate position and asecond substrate position for buffering and substrate cooling. Asubstrate may be cooled from two sides by an air flow from the airshowers. This allows the substrate to stay during a cycle time in thesame position as where the track has delivered the substrate, hencereducing the work load of the robot 10. Each substrate position may beused for substrate buffering in one cycle, and for substrate cooling inthe next cycle.

An embodiment of a track interface which requires less substrate coolingthan the track interface described in the preceding paragraph may beprovided with an air shower for only cooling a single side of thesubstrate in a substrate position. A further elaboration of thisembodiment is given in FIG. 10 which shows a design of verticallystacked substrate (buffer) positions 137.1, 137.2, 137.3 and a fixed airshower 139. The stack is formed by belts 141.1, 141.2 which can berotated according to the arrows 142. The belts are provided withprotrusions (or notches) 143. The protrusions (or notches) of the beltsdefine substrate buffer positions 137.1, 137.2, 137.3 between the belts141.1, 141.2. Only the top substrate positioned in the substrateposition 137.3 is temperature conditioned. After the top substrate isremoved (to the substrate stage), the belts 141.1, 141.2 are rotatedsuch that the track can deliver a new substrate on a new created lowersubstrate position (for example position 137.1). Since the belts rotateand move new substrates to the substrate cooling position 137.3 the airshower 139 can stay in a fixed position.

While specific embodiments of the invention have been described above,it will be appreciated that the invention may be practiced otherwisethan as described. As such, the description is not intended to limit theinvention. The configuration, operation, and behavior of the presentinvention has been described with the understanding that modificationsand variations of the embodiments are possible, given the level ofdetail present herein. Thus, the preceding detailed description is notmeant or intended to, in any way, limit the invention—rather the scopeof the invention is defined by the appended claims.

1. A lithographic apparatus, comprising: (a) a processing unitconfigured to process a substrate, the processing unit comprising: anillumination system that provides a beam of radiation; a supportstructure configured to support a patterning device that imparts adesired pattern to the beam of radiation; a substrate holder configuredto hold the substrate; a projection system configured to project thepatterned beam onto a target portion of the substrate; and (b) a trackinterface arranged adjacent the processing unit in which the patternedbeam is projected onto the target portion of the substrate, the trackinterface having a loading station configured to hold more than onesubstrate to be processed by the processing unit and a discharge stationconfigured to hold a substrate processed by the processing unit; (c) atransfer unit arranged in the track interface and comprising more thanone robot configured to directly transfer the substrate to be processedfrom the loading station to the processing unit and to directly transferthe substrate processed from the processing unit to the dischargestation.
 2. The lithographic apparatus of claim 1, further comprising areceiving unit that receives the substrate to be processed from a trackconfigured to move objects between different processing stations of aproduction line.
 3. The lithographic apparatus of claim 2, wherein thereceiving unit is positioned below the discharge station.
 4. Thelithographic apparatus of claim 2, wherein the receiving unit includes atemperature conditioner to adjust the temperature of the substrate. 5.The lithographic apparatus of claim 1, wherein the discharge station isconfigured to supply the processed substrate to a track configured tomove objects between different processing stations of a production line.6. The lithographic apparatus of claim 1, wherein the loading stationcomprises a pre-alignment unit that determines at least one dimensionand a position of the substrates to be processed and loaded into theprocessing unit.
 7. The lithographic apparatus of claim 1, wherein thetrack interface further comprises a controller that controls at leastone of the robots and the substrate flow.
 8. The lithographic apparatusof claim 1, wherein the track interface further comprises a holder thatserves to feed substrates to the track interface.
 9. The lithographicapparatus of claim 1, wherein the track interface is configured withmore than one input unit.
 10. The lithographic apparatus of claim 9,wherein one input supplies substrates to a pre-aligner station andanother input supplies substrates to a receiving unit.
 11. Thelithographic apparatus of claim 1, wherein the track interface isconfigured with a plurality of substrate positions that are stackedvertically to form a substrate buffer.
 12. The lithographic apparatus ofclaim 11, wherein the substrate positions of the substrate buffer arelocated between air showers.
 13. The lithographic apparatus of claim 11,wherein the substrate buffer is configured to move along the verticaldirection via a motor or actuator.
 14. The lithographic apparatus ofclaim 11, wherein the substrate buffer is configured with a single airshower and a rotatable belt assembly with protrusions or notches thatdefine the substrate positions of the substrate buffer.
 15. Thelithographic apparatus of claim 1, wherein the track interface ispositioned between the processing unit and a track so as to be in directcommunication with both the processing unit and the track, the trackconfigured to convey objects between different processing stations of aproduction line.